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SIMCom combines with Infineon, Kigen on ‘smallest’ eSIM-based NB-IoT module

China-based IoT module maker SIMCom is offering its SIM7070 series NB-IoT device with an embedded SIM (eSIM) from German chipmaker Infineon, making the 24 mm x 24 mm SIM7070 the most compact eSIM-enabled module on the market. It is “significantly smaller” than standard eSIM-based...

IoT modules and modems shorten path to market for developers

Low-power cellular connectivity standards are creating new opportunities for companies that want to connect assets or equipment in a secure and reliable way. But unlike the IoT devices that leverage unlicensed spectrum, those in the licensed bands require carrier certification in order to operate...

U-blox to buy SIMCom’s cellular module business

Consolidation continues in the semiconductor market, with two makers of internet of things modules joining forces. Switzerland's U-blox is paying $52.5 million in cash for SIMCom's cellular modem products, research and development team and customer base. China's SIMCom, which is currently owned by SimTech...

U-blox to buy SIMCom’s cellular module business

Consolidation continues in the semiconductor market, with two makers of internet of things modules joining forces. Switzerland's U-blox is paying $52.5 million in cash for SIMCom's cellular modem products, research and development team and customer base. China's SIMCom, which is currently owned by SimTech...

IoT ecosystem expands, growth projected for chip sector

Chip news for 12/19/16 1. SIMCom Wireless said it will use Sequans’ LTE chip technology for a series of modules. The maker of "internet of things" and machine-to-machine modules said it will use both of Sequans' low-power LTE solutions, Calliope and Monach. Calliope is a...