HomeAutonomous VehiclesNXP, Foxconn sign deal to drive-forward electric, connected, autonomous vehicles

NXP, Foxconn sign deal to drive-forward electric, connected, autonomous vehicles

Dutch chipmaker NXP Semiconductors is to work with Hon Hai Technology Group (Foxconn) to jointly develop new compute and connectivity platforms for software-defined electric vehicles, offering varying degrees of autonomy. Foxconn will use NXP’s chip portfolio to produce electronic componentry for electrification, connectivity, and automated driving – in that order – in new vehicles.

Foxconn already uses NXP’s i.MX application processors and software-based radio platform for its digital cockpit systems. Their primary focus, they said, is on electrical vehicle (EV) platforms; Foxconn will make use of NXP’s electrification portfolio –”from NXP S32 processors to analog-front-end, drivers, networking, and power products”.

Connectivity is the second aspect, they said, with a focus on ultra-wideband (UWB) and Bluetooth Low Energy (BLE) for in-car connectivity, as well as for interconnection with local infrastructure, such as for security access. Foxconn will use NXP’s S32 domain and zonal controller family for gateways and vehicle networking control, they said.

Their efforts with autonomous driving, as the third focus area for their work, will make use of NXP’s radar solutions. NXP will also offer hardware and software support. NXP’s third-party supplies in the areas of electrification, connectivity and automation will also be engaged.

Young Liu, chairman at Foxconn, said: “Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry. This is a prime opportunity for our particular electronics expertise. NXP’s longstanding expertise and leadership in automotive, its innovative products and its laser focus on safety, security and quality provide the foundation for the collaboration we are activating today.”

Kurt Sievers, president and chief executive at NXP Semiconductors, said: “We are proud to join forces with Foxconn today to support its ambitious leap into automotive and to jointly address the challenges and opportunities of a new generation of smart connected vehicles, especially Foxconn’s new electric vehicle platform. The auto industry must become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next generation architectures, smart and secure car access systems and more.”

Last week, Volkswagen-owned automotive software company CARIAD confirmed work with semiconductor firm STMicroelectronics (ST) to develop a system-on-chip (SoC) for a new line of Volkswagen vehicles based on the CARIAD software platform. At the same time, the parties “are moving to agree” that silicon contract manufacturer Taiwan Semiconductor Manufacturing Company (TSMC) handles wafer production for the ST SoCs.

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